At TCT Asia 2026, AVIMETAL introduced a significant advancement in materials science for additive manufacturing: the MT-T2(Cu) Pure Copper Powder. Designed specifically to overcome the longstanding challenges associated with copper Laser Powder Bed Fusion (LPBF) forming, this high-purity, low-oxygen solution is set to unlock new possibilities across electronics, thermal management, aerospace, and beyond.

Copper has always been a highly desirable material for additive manufacturing due to its exceptional thermal and electrical conductivity. However, its high reflectivity and poor processability have historically posed significant forming difficulties. The MT-T2(Cu) addresses these challenges at the source, delivering a powder optimized for stable, high-quality production.

Key Advantages of MT-T2(Cu) Pure Copper Powder

The MT-T2(Cu) is not just another copper powder—it is a purpose-built material engineered to meet the rigorous demands of industrial LPBF systems. Below are the defining advantages that set it apart.

High Purity & Low Oxygen Content

Specially designed for additive manufacturing, the MT-T2(Cu) achieves stable part density of ≥99.65%. By minimizing oxygen content and ensuring high purity, this powder provides the foundation for producing fully dense components with consistent mechanical properties.

Excellent Thermal and Electrical Conductivity

As a classic copper material, MT-T2(Cu) delivers the high thermal and electrical conductivity that industries such as electronics and thermal management rely upon. Components printed with this material maintain the intrinsic performance characteristics of pure copper.

Superior Mechanical Properties

Beyond conductivity, the material exhibits good plasticity, ductility, and outstanding corrosion resistance. These mechanical attributes make it suitable for functional parts that must withstand demanding operating environments.

Overcoming Copper LPBF Challenges

Historically, copper’s high reflectivity has made stable LPBF forming difficult, often requiring specialized laser sources or processing strategies. The MT-T2(Cu) is optimized from the powder source to mitigate these issues, effectively solving high reflectivity and forming difficulties to enable reliable, repeatable production.

Typical Applications

The combination of high conductivity, mechanical strength, and process stability makes MT-T2(Cu) suitable for a wide range of high-value applications:

• Thermal Management and Heat Dissipation Parts – Ideal for heat sinks, cooling plates, and thermal spreaders where efficient heat transfer is critical.

• Electrical and Conductive Parts – Enables complex geometries for busbars, connectors, and current-carrying components.

• Critical Aerospace Parts – Suitable for applications requiring lightweight, thermally efficient components with reliable mechanical performance.

• Precision Machinery and Wear-Resistant Parts – Offers durability and corrosion resistance for moving components and mechanical assemblies.

• Electronics Manufacturing and New Energy – Supports the growing demand for advanced components in consumer electronics, electric vehicles, and renewable energy systems.

Compatible Printers

The MT-T2(Cu) Pure Copper Powder has been validated for use across AVIMETAL’s comprehensive range of LPBF systems, ensuring seamless integration for existing and new users. Compatible printers include:

• MT170H

• MT280

• MT400M

• MT450

• MT450M

• MT650

• MT650H

• MT800H

• MT1300

• MT1550

This broad compatibility allows manufacturers to adopt the material across multiple platforms, standardizing workflows and scaling production with confidence.

Conclusion

The introduction of MT-T2(Cu) Pure Copper Powder at TCT Asia 2026 represents a meaningful step forward in expanding the capabilities of metal additive manufacturing. By addressing the fundamental challenges of copper LPBF forming—high reflectivity and processing instability—AVIMETAL has delivered a material that combines purity, conductivity, and mechanical integrity in a production-ready solution.

For industries ranging from electronics to aerospace, this powder opens the door to complex, high-performance copper components that were previously difficult to achieve reliably.

Interested in integrating MT-T2(Cu) into your additive manufacturing workflow? Contact our team for technical datasheets, sample inquiries, or to discuss application-specific requirements.